XC3S1000-4FTG256I

Product Summary

The XC3S1000-4FTG256I Field-Programmable Gate Array is specifically designed to meet the needs of high volume, cost-sensitive consumer electronic applications. The eight-member family offers densities ranging from 50,000 to five million system gates. The XC3S1000-4FTG256I builds on the success of the earlier Spartan-IIE family by increasing the amount of logic resources, the capacity of internal RAM, the total number of I/Os, and the overall level of performance as well as by improving clock management functions. Numerous enhancements derive from state-of-the-art Virtex-II technology. These Spartan-3 enhancements, combined with advanced process technology, deliver more functionality and bandwidth per dollar than was previously possible, setting new standards in the programmable logic industry.

Parametrics

XC3S1000-4FTG256I absolute maximum ratings: (1)VCCINT Internal supply voltage: –0.5 to 1.32 V; (2)VCCAUX Auxiliary supply voltage: –0.5 to 3.00 V; (3)VCCO Output driver supply voltage: –0.5 to 3.75 V; (4)VREF Input reference voltage: –0.5 to VCCO+0.5 V; (5)VIN Voltage applied to all User I/O pins and Dual-Purpose pins: –0.5 to VCCO+0.5 V; Voltage applied to all Dedicated pins: –0.5 to VCCAUX+0.5 V; (6)TJ Junction temperature: VCCO ≤ 3.0V: 125 ℃; VCCO > 3.0V: 105 ℃; (7)TSOL Soldering temperature: 220 ℃; (8)TSTG Storage temperature: –65 to 150 ℃.

Features

XC3S1000-4FTG256I features: (1)Revolutionary 90-nanometer process technology; (2)Very low cost, high-performance logic solution for high-volume, consumer-oriented applications; (3)Up to 784 I/O pins; (4)622 Mb/s data transfer rate per I/O; (5)Seventeen single-ended signal standards; (6)Seven differential signal standards including LVDS; (7)Termination by Digitally Controlled Impedance; (8)Signal swing ranging from 1.14V to 3.45V; (9)Double Data Rate (DDR) support; (10)Abundant logic cells with shift register capability; (11)Wide multiplexers; (12)Fast look-ahead carry logic; (13)Dedicated 18 x 18 multipliers; (14)JTAG logic compatible with IEEE 1149.1/1532 specifications; (15)Up to 1,872 Kbits of total block RAM; (16)Up to 520 Kbits of total distributed RAM; (17)Eight global clock lines and abundant routing; (18)Fully supported by Xilinx ISE development system; (19)Synthesis, mapping, placement and routing; (20)MicroBlaze processor, PCI, and other cores.

Diagrams